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Cleanseal M – Mono-Solvent Ultrasonic Cleaning System
Advanced Precision Cleaning Technology from MEG S.r.l. for use with MicroCare Tergo fluids
The Cleanseal M – Mono-Solvent Ultrasonic Cleaning System, manufactured by MEG S.r.l., is an advanced, fully enclosed industrial cleaning solution engineered to deliver exceptional levels of cleanliness, process consistency and operational efficiency.
Designed for industries where component cleanliness is critical, the Cleanseal M combines the powerful cleaning action of ultrasonic technology with the effectiveness of solvent immersion and vapour cleaning. This integrated approach enables the thorough removal of oils, greases, machining fluids, flux residues, waxes and other persistent contaminants from precision-engineered components.
The system is particularly suited to components featuring complex geometries, internal cavities, blind holes, fine tolerances and intricate surfaces that can be difficult to clean using conventional methods.
By combining multiple cleaning stages within a fully enclosed system, the Cleanseal M offers manufacturers a controlled, repeatable and efficient cleaning process suitable for both small-batch precision cleaning and demanding industrial production environments.
How the Cleanseal M Mono-Solvent Cleaning System Works
The Cleanseal M operates using a single suitable non-flammable cleaning solvent such as MicroCares range of Tergo performance fluids, combining ultrasonic agitation, solvent cleaning and vapour treatment within an integrated process chamber, controlled by sub zero cooling which keeps the fluid inside the machine
Unlike conventional multi-tank cleaning systems, the Cleanseal M is designed around a compact, enclosed processing arrangement that helps minimise equipment footprint while maintaining high cleaning performance.
A single-axis automated handling system with a 20Kg capacity moves the workbasket through the complete cleaning sequence, providing consistent positioning and controlled component movement throughout the process.
Ultrasonic Solvent Cleaning
During the ultrasonic cleaning stage, high-frequency sound waves generate microscopic cavitation bubbles within the cleaning solvent. As these bubbles form and collapse, they create an intensive cleaning action that helps dislodge contaminants from component surfaces.
This process is especially effective for cleaning intricate components, including internal passages, threaded features, blind holes and difficult-to-access areas.
Ultrasonic agitation helps remove tightly adhering contamination while reducing the need for aggressive mechanical cleaning methods.
Vapour- Cleaning
The vapour cleaning stage provides an additional level of cleaning by exposing components to solvent vapour within the enclosed process chamber.
As the vapour condenses on cooler component surfaces, it helps dissolve and remove residual contamination, supporting a high-quality final cleaning result.
This process is particularly beneficial for precision components requiring consistent surface cleanliness prior to subsequent manufacturing, assembly or finishing operations.
Automated Workbasket Handling
The Cleanseal M incorporates a single-axis handling system that automatically transfers the workbasket through the programmed cleaning process.
This automated movement reduces manual intervention, improves process repeatability and helps maintain consistent cleaning conditions between batches.
By integrating component handling with the cleaning cycle, the system provides a practical solution for manufacturers seeking reliable, repeatable cleaning performance the complete process.